BVM has introduced the EBC-965, a fanless Socket P Core 2 Duo embedded computer module housed in an open frame chassis with an integral heat sink.
The product is designed for use as an engine in applications such as public information points, kiosks, multi-media displays with audio for retail stores or exhibitions. It supports dual VGA and TV out, driven by an integrated Intel GMA X3100 high performance graphic processor.
The Mini-ITX form factor motherboard supports a Socket P Core 2 Duo CPU with an 800MHz FSB, up to 4GB of DDR2 memory and runs under the GME965 system chipset. Gigabit Ethernet, a Mini-PCI expansion slot, six USB2.0 ports, two SATA interfaces and a CompactFlash socket are provided on-board.
The motherboard is assembled to a robust metal baseplate under the module and a heatsink is fitted above the CPU, enabling fanless operation in many applications. For use in difficult environments, additional forced cooling can easily be added to the system. The mechanically secure assembly can be mounted directly to the wall of an equipment cabinet or embedded within a larger enclosure; various mounting options are provided including a VESA mount, side rails or brackets. The board is powered from a single 12 Volt supply from an external 96 Watt PSU via a 4pin DIN connector.